Tin was widely used in various industries like electronic and others for its ability to protect the oxidation of base metal, thus maintaining its ability to pay. In the electronic applications, the lead is added for prevention of metal growth whiskers that can disturb deposits, which would otherwise cause an electrical short circuit.

The method of tin plating

The method of tin plating is used to protect the surfaces of ferrous and the non- ferrous metals. The tin is helpful metal in the food industry as it is corrosion resistant, ductile and non toxic. High quality toughness tin plated sheet metal base is comprised of various shapes without destroying the surface layer of tin. This offers sacrificial protection of nickel, copper along with non – ferrous metals, but not with the steel.

The process

The tin plating is the use of electrochemical incline of conductive solution. Ionized particles of tin melted in a solution and are controlled by the electrochemical and notes deposited on the fine layers from the plated object. Before tinning be unsoiled of oxides and dust or the organic material which can prevent the plating process. During the plating, the control of pollutants and temperature are important for a successful end product. Despite all the efforts, in price and time limits, the error can happen to the end product. From these errors, the tin whiskers were very precise, as they appear or else sufficient and plated products and do have the ability to wreak havoc from gold plated electronic parts.


The pan should be soaked in a clean tray, the electrical current, the mechanical equipment and the essences can make sure the purity adequate basis for applying application.

Plating – prepare a coating solution bath preferred for electrochemical reflections in hand. Cleaned tin was deposited in the electrolyte solution can act as anode. The object that be plated should be positioned to the same solution then acts as cathode. As the existing is used, ions are melted in electrolytic bath then travel to be plated. Because tin ions should have to be floated to the silver object, these anodes and the cathode have to be the same container that is filled with electrolytic bath solutions.